Protocol RL-201 // Jacobs Working Curve
Resin Exposure Time &
Jacobs Working Curve Calculator
Calculate calibrated MSLA and DLP curing times using the Jacobs Photopolymer Equation (Cd = Dp · ln(Emax / Ec)), penetration depth, critical exposure energy, and light engine UV irradiance.
1. Select Photopolymer Resin Chemistry
2. UV Light Engine Optical Irradiance
3. Layer Thickness & Inter-Layer Overcure Margin
50 μm (0.050 mm)
25 μm (Ultra Micro-Detail)50 μm (Standard Production)100 μm (Rapid Draft)
+30%
Ensures the cure depth (Cd = 65 μm) penetrates into the preceding layer to eliminate delamination.Exposure Recipe Output
Standard Rigid Slicer Parameters
Normal Layer Exposure3.13sper 50μm layer
Burn-in Base Layer25.0sx 5 layers
Jacobs Working Curve Metrics:
Critical Energy (Ec):7.2 mJ/cm²
Penetration Depth (Dp):155 μm
Target Cure Depth (Cd):65 μm
Required Surface Energy (Emax):10.95 mJ/cm²
Kinetics Caviat:
Fast-acting free-radical acrylate photopolymer. High reactivity, moderate light bleed at high exposure.